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31 Produits
| Photo. | Type | Prix | Quantité | Stocks | Fabricant | Description | Package / Case | Series | Packaging | Memory Type | Memory Size | Technology | Access Time | Mounting Type | Operating Temperature | Part Status | Memory Format | Write Cycle Time - Word, Page | Memory Interface | Voltage - Supply | Supplier Device Package | Factory Stock | Minimum Quantity | |
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Regarder | Texas Instruments | IC NVSRAM 2M PARALLEL 32DIP | 32-DIP Module (0.61", 15.49mm) | - | Tube | Non-Volatile | 2Mb (256K x 8) | NVSRAM (Non-Volatile SRAM) | 120ns | Through Hole | 0°C ~ 70°C (TA) | Obsolete | NVSRAM | 120ns | Parallel | 4.5 V ~ 5.5 V | 32-DIP Module (18.42x52.96) | 0 | 15 | |||
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Regarder | Winbond Electronics | IC FLASH 4M PARALLEL 32PLCC | 32-LCC (J-Lead) | - | Tube | Non-Volatile | 4Mb (512K x 8) | Flash | 300ns | Surface Mount | 0°C ~ 70°C (TA) | Obsolete | Flash | - | Parallel | 3 V ~ 3.6 V | 32-PLCC (11.43x13.97) | 0 | 15 | |||
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Regarder | Winbond Electronics | IC FLASH 1M PARALLEL 32PLCC | 32-LCC (J-Lead) | - | Tube | Non-Volatile | 1Mb (128K x 8) | Flash | 90ns | Surface Mount | 0°C ~ 70°C (TA) | Obsolete | Flash | 10ms | Parallel | 4.5 V ~ 5.5 V | 32-PLCC (11.43x13.97) | 0 | 15 | |||
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Regarder | Winbond Electronics | IC EEPROM 512K PARALLEL 28DIP | 28-DIP (0.600", 15.24mm) | - | Tube | Non-Volatile | 512Kb (64K x 8) | EEPROM | 45ns | Through Hole | 0°C ~ 70°C (TA) | Obsolete | EEPROM | - | Parallel | 4.75 V ~ 5.25 V | 28-PDIP | 0 | 15 | |||
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Regarder | Microchip Technology | IC EEPROM 4M PARALLEL 32FLATPCK | 32-CFlatpack | - | Tube | Non-Volatile | 4Mb (512K x 8) | EEPROM | 250ns | Surface Mount | -40°C ~ 85°C (TC) | Obsolete | EEPROM | 10ms | Parallel | 4.5 V ~ 5.5 V | 32-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | |||
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Regarder | Microchip Technology | IC EEPROM 4M PARALLEL 32FLATPCK | 32-CFlatpack | - | Tube | Non-Volatile | 4Mb (512K x 8) | EEPROM | 250ns | Surface Mount | 0°C ~ 70°C (TC) | Obsolete | EEPROM | 10ms | Parallel | 4.5 V ~ 5.5 V | 32-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | |||
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Regarder | Microchip Technology | IC EEPROM 4M PARALLEL 32FLATPCK | 32-CFlatpack | - | Tube | Non-Volatile | 4Mb (512K x 8) | EEPROM | 200ns | Surface Mount | -40°C ~ 85°C (TC) | Obsolete | EEPROM | 10ms | Parallel | 4.5 V ~ 5.5 V | 32-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | |||
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Regarder | Microchip Technology | IC EEPROM 4M PARALLEL 32FLATPCK | 32-CFlatpack | - | Tube | Non-Volatile | 4Mb (512K x 8) | EEPROM | 200ns | Surface Mount | 0°C ~ 70°C (TC) | Obsolete | EEPROM | 10ms | Parallel | 4.5 V ~ 5.5 V | 32-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | |||
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Regarder | Renesas Electronics America Inc. | IC NVSRAM 4K PARALLEL 28DIP | 28-DIP (0.600", 15.24mm) | - | Tube | Non-Volatile | 4Kb (512 x 8) | NVSRAM (Non-Volatile SRAM) | 150ns | Through Hole | 0°C ~ 70°C (TA) | Obsolete | NVSRAM | 150ns | Parallel | 4.5 V ~ 5.5 V | 28-PDIP | 0 | 15 | |||
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Regarder | Microchip Technology | IC EEPROM 1M PARALLEL 32FLATPCK | 32-CFlatpack | - | Tube | Non-Volatile | 1Mb (128K x 8) | EEPROM | 120ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | 10ms | Parallel | 4.5 V ~ 5.5 V | 32-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | |||
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Regarder | Microchip Technology | IC EEPROM 1M PARALLEL 32FLATPCK | 32-CFlatpack | - | Tube | Non-Volatile | 1Mb (128K x 8) | EEPROM | 150ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | 10ms | Parallel | 4.5 V ~ 5.5 V | 32-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | |||
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Regarder | Microchip Technology | IC EEPROM 1M PARALLEL 32FLATPCK | 32-CFlatpack | - | Tube | Non-Volatile | 1Mb (128K x 8) | EEPROM | 250ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | 10ms | Parallel | 4.5 V ~ 5.5 V | 32-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | |||
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Regarder | Microchip Technology | IC EEPROM 1M PARALLEL 32FLATPCK | 32-CFlatpack | - | Tube | Non-Volatile | 1Mb (128K x 8) | EEPROM | 200ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | 10ms | Parallel | 4.5 V ~ 5.5 V | 32-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | |||
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Regarder | Microchip Technology | IC EEPROM 256K PARALLEL 28FLATPK | 28-CFlatPack | - | Tube | Non-Volatile | 256Kb (32K x 8) | EEPROM | 90ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | 10ms | Parallel | 4.5 V ~ 5.5 V | 28-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | |||
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Regarder | Microchip Technology | IC EEPROM 256K PARALLEL 28FLATPK | 28-CFlatPack | - | Tube | Non-Volatile | 256Kb (32K x 8) | EEPROM | 120ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | 3ms | Parallel | 4.5 V ~ 5.5 V | 28-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | |||
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Regarder | Microchip Technology | IC EEPROM 256K PARALLEL 28FLATPK | 28-CFlatPack | - | Tube | Non-Volatile | 256Kb (32K x 8) | EEPROM | 120ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | 10ms | Parallel | 4.5 V ~ 5.5 V | 28-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | |||
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Regarder | Microchip Technology | IC EEPROM 256K PARALLEL 28FLATPK | 28-CFlatPack | - | Tube | Non-Volatile | 256Kb (32K x 8) | EEPROM | 90ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | 10ms | Parallel | 4.5 V ~ 5.5 V | 28-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | |||
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Regarder | Microchip Technology | IC EEPROM 256K PARALLEL 28FLATPK | 28-CFlatPack | - | Tube | Non-Volatile | 256Kb (32K x 8) | EEPROM | 90ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | 10ms | Parallel | 4.5 V ~ 5.5 V | 28-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | |||
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Regarder | Microchip Technology | IC EEPROM 256K PARALLEL 28FLATPK | 28-CFlatPack | - | Tube | Non-Volatile | 256Kb (32K x 8) | EEPROM | 150ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | 10ms | Parallel | 4.5 V ~ 5.5 V | 28-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | |||
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Regarder | Microchip Technology | IC EEPROM 256K PARALLEL 28FLATPK | 28-CFlatPack | - | Tube | Non-Volatile | 256Kb (32K x 8) | EEPROM | 120ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | 10ms | Parallel | 4.5 V ~ 5.5 V | 28-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | |||
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Regarder | Microchip Technology | IC EEPROM 256K PARALLEL 28FLATPK | 28-CFlatPack | - | Tube | Non-Volatile | 256Kb (32K x 8) | EEPROM | 150ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | 3ms | Parallel | 4.5 V ~ 5.5 V | 28-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | |||
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Regarder | Microchip Technology | IC EEPROM 256K PARALLEL 28FLATPK | 28-CFlatPack | - | Tube | Non-Volatile | 256Kb (32K x 8) | EEPROM | 200ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | 10ms | Parallel | 4.5 V ~ 5.5 V | 28-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | |||
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Regarder | Microchip Technology | IC EEPROM 256K PARALLEL 28FLATPK | 28-CFlatPack | - | Tube | Non-Volatile | 256Kb (32K x 8) | EEPROM | 150ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | 10ms | Parallel | 4.5 V ~ 5.5 V | 28-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | |||
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Regarder | Microchip Technology | IC EEPROM 256K PARALLEL 28FLATPK | 28-CFlatPack | - | Tube | Non-Volatile | 256Kb (32K x 8) | EEPROM | 250ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | 10ms | Parallel | 4.5 V ~ 5.5 V | 28-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | |||
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Regarder | Microchip Technology | IC EEPROM 256K PARALLEL 28FLATPK | 28-CFlatPack | - | Tube | Non-Volatile | 256Kb (32K x 8) | EEPROM | 250ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | 10ms | Parallel | 4.5 V ~ 5.5 V | 28-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | |||
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Regarder | Microchip Technology | IC EEPROM 256K PARALLEL 28FLATPK | 28-CFlatPack | - | Tube | Non-Volatile | 256Kb (32K x 8) | EEPROM | 150ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | 10ms | Parallel | 4.5 V ~ 5.5 V | 28-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | |||
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Regarder | Microchip Technology | IC EEPROM 256K PARALLEL 28FLATPK | 28-CFlatPack | - | Tube | Non-Volatile | 256Kb (32K x 8) | EEPROM | 250ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | 10ms | Parallel | 4.5 V ~ 5.5 V | 28-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | |||
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Regarder | Microchip Technology | IC EEPROM 256K PARALLEL 28FLATPK | 28-CFlatPack | - | Tube | Non-Volatile | 256Kb (32K x 8) | EEPROM | 250ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | 10ms | Parallel | 4.5 V ~ 5.5 V | 28-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | |||
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Regarder | Microchip Technology | IC EEPROM 256K PARALLEL 28FLATPK | 28-CFlatPack | - | Tube | Non-Volatile | 256Kb (32K x 8) | EEPROM | 150ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | 10ms | Parallel | 4.5 V ~ 5.5 V | 28-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | |||
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Regarder | Microchip Technology | IC EEPROM 256K PARALLEL 28FLATPK | 28-CFlatPack | - | Tube | Non-Volatile | 256Kb (32K x 8) | EEPROM | 200ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | 10ms | Parallel | 4.5 V ~ 5.5 V | 28-Flatpack, Ceramic Bottom-Brazed | 0 | 15 |
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